Different fields of application
- Clean room Class 10000 (Fed. Stand. 209d) Class 7 (ISO 14644-1)
- Wedge bonding with gold and aluminum wire.
- Gold: 25µm and 50µm
- Aluminum: wire from 30 µm up to 350 µm
- Substrates used for die attach: Ceramic, PCB (FR4) and IMS (Al or Cu based)
- Glob top encapsulation or cavity filling.