The Company started its operations in 1990 as Sistemas de Microelectronica (Simesa); a joint venture between the German company MBB (later known as TEMIC) and the Spanish company Gamesa. The Company’s core competence is the design and manufacturing of thick film hybrids, either on ceramic or stainless steel substrates, initially intended for the Defense, Medical and High reliability industrial markets.

In 1999, the German Beru Group acquired 100% of the shares and the company was renamed Beru Microelectronica. This provided us with entrance into the highly competitive automotive market, not only for hybrids, but also for PCB based circuits and sensors.

In the following years, the Company has also expanded into the transport and environmental markets, especially in CPV (Concentrated Photovoltaic) solar receivers, including the assembly of the associated lens.

In 2012, following a Management buyout, the Company changed it’s name to Hybtronics Microsystems. The resulting independent ownership allows us to fully support all our customers in all of our markets, a goal that was becoming increasing difficult under the new Beru Group owners, who were increasingly focused on their core Automotive business.

The depth of experience collected throughout the years, allows us to offer all our customers a reliable, high quality product, using the most adequate and advanced technology throughout the product cycle.

We have quality accreditation and certification: ISO 9001:2015 and IATF 16949

The majority of the actual Hybtronics thick film products are customized solutions designed to fit our customers specific requirements.